Development of MRR enhancement technology by film quality such as W/Cu/Oxide/Poly/Nitride, etc
Development of materials to reduce defects and extend pad lifetime
Development of eco-friendly material designs and pad conditioning/regeneration technologies

Addresses various types of PRs (ArF, KrF, DFR) removal
Suppress pattern and metal damage, enhance metal and film compatibility
Low residual-based High-efficiency peeling technology

Development of transparent microlens material for CMOS image sensor
Low- and high-refractive-index material solutions
Apply highly reliable packaging and sensor processes

Remove various contaminants such as PR/Metal residue, Glue, Flux, etc
Develop step-by-step solutions such as Post CMP/Post etch/Metal gate
Target to minimize damage to the substrate and implement zero pollutant surfaces

Precision etching solutions for various metal layers such as Cu/Ti/TiW
Process selectivity and metal damage suppression technology
Material design to improve pattern uniformity and process reliability